Redpine's Lite-Fi>® family of ultra low power Wi-Fi® processors provides unprecedented power profiles for 802.11n. The RS9110 is Redpine's third generation low power product addressing the mobile and portable markets.
The RS9110 uses advanced system-level power management techniques and to reduce power significantly. The RS9110 is packaged in WLCSP and UFLGA. The WLCSP device (0.35mm thickness) enables Micro SD and SiP 802.11n modules for the mobile market.
Redpine's Maxi-Fi® family of high performance single chip 802.11b/g/n SoC chipsets cater to the higher-throughput PC and Access Point market segments. They incorporate Redpine's fourth-generation 802.11 technology, leveraging our vast WLAN patent-portfolio developed over the past eight years, and stand out in wireless performance in adverse environments. The products include the RS9115 2.4 GHz chip with PCI interface, the RS9116 2.4 GHz chip with SDIO and SPI interfaces, the RS9117 dual-band 2.4/5 GHz chip with SDIO and SPI interfaces, and the RS9118 dual-band 2.4/5 GHz chip with PCI, SDIO and SPI interfaces. The Maxi-Fi® BEAM150™ device family complements Redpine Signals' highly successful ultra-low power 802.11n Lite-Fi® device family.

Redpine's module products are carefully architected to present optimal solutions to a variety of applications. These modules integrate the 802.11n MAC/BBP, RF, configuration flash, and other required components, resulting in a very low BOM. Separate solutions address varied application-specific requirements; and the modules include a low cost and an ultra-low form factor SDIO/SPI based WLAN client, and a dual-band SDIO/SPI WLAN client. The n-Link products are targeted for high througput applications with medium or high capacity host processor, while the Connect-io-n modules address the needs of the embedded systems market built around a variety of microcontrollers of all types.

Redpine's Lite-Fi>® family of ultra low power Wi-Fi® processors provides unprecedented power profiles for 802.11n. The RS9110 is Redpine's third generation low power product addressing the mobile and portable markets.
The RS9110 uses advanced system-level power management techniques and to reduce power significantly. The RS9110 is packaged in WLCSP and UFLGA. The WLCSP device (0.35mm thickness) enables Micro SD and SiP 802.11n modules for the mobile market.
Redpine's Maxi-Fi® family of high performance single chip 802.11b/g/n SoC chipsets cater to the higher-throughput PC and Access Point market segments. They incorporate Redpine's fourth-generation 802.11 technology, leveraging our vast WLAN patent-portfolio developed over the past eight years, and stand out in wireless performance in adverse environments. The products include the RS9115 2.4 GHz chip with PCI interface, the RS9116 2.4 GHz chip with SDIO and SPI interfaces, the RS9117 dual-band 2.4/5 GHz chip with SDIO and SPI interfaces, and the RS9118 dual-band 2.4/5 GHz chip with PCI, SDIO and SPI interfaces. The Maxi-Fi® BEAM150™ device family complements Redpine Signals' highly successful ultra-low power 802.11n Lite-Fi® device family.